Integrated Design Ecosystem For Chiplets And Heterogeneous Integration In Advanced Packaging Technology

"Chiplets are reshaping tech, and ASE’s new Integrated Design Ecosystem is leading the charge! By enabling seamless multi-die integration with 50% faster design cycles, it’s a game-changer for AI and HPC. But here’s the twist: this trend could drive demand for high-precision paper-based packaging to protect these advanced components during shipping. Think enhanced sustainability meets cutting-edge tech! Paper packaging players, take note—this is your chance to innovate and align with the future of microelectronics."https://ase.aseglobal.com/blog/technology/ide-for-chiplets-and-hi-in-advanced-packaging-technology/

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