MZ Technologies Unveils Next Generation Chiplet/Package Design Tool

\"Today, we’re diving into MZ Technologies’ groundbreaking GENIO EVO, unveiled on January 14, 2025. This tool revolutionizes 3D-IC design by tackling thermal and mechanical stress in the pre-layout stage. Why does this matter to the paper packaging industry? The rise of 3D chiplet technology demands ultra-precise packaging for electronics, opening new opportunities for paper-based solutions like sustainable cushioning or heat-resistant barriers. With GENIO EVO improving yields and reducing design cycles, the demand for innovative, eco-friendly packaging materials could skyrocket. Stay tuned for the ripple effects on sustainable packaging innovation!\"https://finance.yahoo.com/news/mz-technologies-unveils-next-generation-080400952.html

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