Siemens streamlines design flows for TSMC 3DFabric technologies

"Big news from Siemens Digital Industries Software—an automated, certified workflow for TSMC's InFO packaging technology is now live! This means faster, more efficient semiconductor packaging, but what does it mean for paper-based packaging? As chip production scales up with advanced workflows, demand for protective paper-based packaging for electronics could skyrocket. Expect innovations in fiber-based cushioning and anti-static paper solutions to meet sustainability goals while protecting delicate components. The future of semiconductor logistics just got a whole lot greener!"https://www.digitimes.com/news/a20250218VL208/siemens-tsmc-design-3dfabric-packaging.html

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